Characterization of Integrated Circuit Packaging Materials

by Moore, Thomas M.; McKenna, Robert G.

Edition: Revised

ISBN13: 9781606501870

ISBN10: 1606501879

Format: Hardcover

Pub. Date: 2009-12-01

Publisher(s): Momentum Pr

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Summary

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold comTPund adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC comTPnents, and interconnect systems.

Foreword	p. xi
Preface to the Reissue of the Materials Characterization Series	p. xiii
Preface to Series	p. xiv
Preface to the Reissue of Integrated Circuit Packaging Materials	p. xv
Preface	p. xvi
Contributors	p. xix
IC Package Reliability Testing
Introduction	p. 1
In-Process Quality Measurements	p. 2
Wire Bond Quality	p. 3
Die Attach Quality	p. 4
Other Process Control Measurements	p. 8
Package-Oriented Reliability Testing of Finished Devices: Moisture Testing	p. 10
Failure Analysis of Moisture-Related Failures	p. 11
Root Causes of Corrosion Failures	p. 12
Package-Oriented Reliability Testing of Finished Devices: Thermal Cycle Testing	p. 14
Bond Failures: Bond Pad Contamination	p. 16
Intermetallic Formation and Other Elements of Bond Formation	p. 18
Reliability Test Preconditioning: A New Direction	p. 23
Summary	p. 25
Mold Compound Adhesion and Strength
Introduction	p. 27
Thermodynamic Consideration of Adhesion	p. 28
Work of Adhesion	p. 28
The Work of Adhesion from Contact Angle Measurements	p. 30
Work of Adhesion in the Presence of Moisture and Lubricants	p. 30
Adhesive Strength for Various Mold Compound Types	p. 31
Adhesive Strength Measurements	p. 31
Mold Compound Types	p. 31
Adhesive Strength of Various Mold Compounds	p. 32
Various Factors Which Influence Adhesion Strength	p. 33
Effects of Lead Frame Oxides	p. 34
Effects of Different Lead Frame Materials	p. 38
Effects of Adhesion Promoters	p. 40
Effects of Various Mold Release and Processing Aids	p. 41
Effects of Mold Compound Rheology	p. 42
Role of Adhesion in Surface Mount Operations	p. 43
Moisture Absorption and Its Effect on Adhesion	p. 45
Package Delamination and Cracking in VPR and SDIP	p. 45
Role of Adhesion in Package Reliability	p. 48
Metal Line Movement	p. 48
Highly Accelerated Stress Test (HAST)	p. 49
Physical Characterization of Mold Compounds	p. 49
Physical Properties of Various Mold Compounds	p. 49
Cure Kinetics	p. 51
Outlook for Future Mold Compounds	p. 53
Summary	p. 54
Mechanical Stress in IC Packages
Introduction	p. 57
Stress and Strain Relations: An Overview	p. 58
Stress Generation in IC Packages	p. 61
Tools for Stress Determination in IC Packages	p. 63
Finite Element Analysis	p. 64
Strain Gauges for Stress Analysis	p. 64
Moire Interferometry	p. 64
Indirect Stress Determination	p. 64
Application of Techniques to IC Packaging Problems	p. 64
Eutectic Die Attach	p. 65
Passivation Damage at Chip Corners	p. 66
Ball Bond Stresses	p. 68
Solder Reflow Damage	p. 69
Tape Automated Bonding Inner Lead Stresses	p. 72
Filler Particle-Induced Damage	p. 73
Mechanical Warpage	p. 73
Mechanical Damage	p. 74
Parametric Shifts Related to Package Stresses	p. 74
Solder Joint Stress and the Coffin-Manson Relation	p. 75
Summary	p. 76
Moisture Sensitivity and Delamination
Introduction	p. 79
Moisture/Reflow Sensitivity Evaluations	p. 81
Moisture Sensitivity Classification	p. 81
Moisture Absorption: Preconditioning	p. 83
Solder Reflow Damage	p. 85
Impact on Temperature-Cycle Performance	p. 91
Impact on THB Performance	p. 92
Moisture Desorption: Bake-Out	p. 93
Summary	p. 94
Thermal Management
Introduction	p. 97
IC Package Thermal Characteristics	p. 99
Factors Affecting Package Thermal Resistance	p. 105
Package Design	p. 105
Package Material Thermal Conductivity	p. 107
Die Attach Material	p. 111
Package Size and Die Size Effects	p. 111
Package Defects	p. 112
PCB Effect on Thermal Performance	p. 113
The Effect of Neighboring Components	p. 114
Heat Fins	p. 115
Thermal Design Challenges of Multi-Chip Modules	p. 115
Summary	p. 116
Electrical Performance of IC Packages
Introduction	p. 121
Designing for Performance	p. 123
Electrical Models for Packages and Interconnects	p. 125
Low Frequency Models	p. 125
Propagation Delay and Packaging	p. 127
Clock Frequency, Bandwidth, and Rise Time	p. 127
Propagation Delay	p. 128
RC Delay	p. 128
Time of Flight	p. 128
Switching Noise	p. 130
Signal Integrity	p. 134
Crosstalk	p. 135
Materials and Design Trends for High-Performance Packaging	p. 138
Summary	p. 143
Solderability of Integrated Circuits
Introduction	p. 145
Electronic Soldering Basics	p. 146
Soldering Definitions	p. 146
Solder Joints for Electronic Packages	p. 147
Solderability Defect Classifications	p. 147
IC Package Designs, Materials, and Solderability Test Methods	p. 148
Through-Hole Package Designs and Materials	p. 148
Surface Mount Package Designs and Materials	p. 150
Tape Automated Bonding Package Design and Materials	p. 152
IC Solderability Defects	p. 152
Through-Hole Solderability Problems	p. 152
SMT Solder Electroplating Process Defects	p. 155
SMT Lead Finish Defects	p. 158
SMT Solderability Problems Due to Mechanical Damage	p. 159
TAB Solderability Problems	p. 161
Solderability of IC Packages to PCBs	p. 162
Printed Circuit Boards	p. 162
Electronic Solders, Fluxes, and Pastes	p. 163
Summary	p. 165
Hermeticity and Joining in Ceramic IC Packages
Introduction	p. 167
Materials for Hermetic IC Packaging	p. 169
Hermeticity Testing-History	p. 173
Theory of Hermeticity Testing	p. 174
Gross-Leak Testing Methodology	p. 177
Hermeticity Failure Analysis	p. 178
Alternatives to Hermetic Packaging	p. 182
Summary	p. 183
Advanced Interconnect Technology
Introduction	p. 187
MCM Technology Classifications	p. 188
MCM Materials Selection	p. 190
Substrate Materials and Design	p. 191
Polyimide Dielectrics	p. 194
Test Substrates	p. 195
Power Density	p. 196
Die Mounting and Stress	p. 198
Die Bond Adhesive Strength	p. 199
Flip-Chip Technology	p. 200
Die Interconnection	p. 201
Wire Bond Technology	p. 201
Bond Optimization	p. 203
MCM Packages	p. 204
Substrate-Based Packages	p. 204
Summary	p. 205
Technique Summaries
Acoustic Microscopy (C-AM)	p. 209
Atomic Absorption Spectrometry (AAS)	p. 213
Auger Electron Spectroscopy (AES)	p. 214
Ceramic Plate Test (CPT) for Evaluating Solderability of IC Devices	p. 215
Coulometric Method for Solderability Evaluation	p. 218
Decapsulation Techniques	p. 222
Differential Scanning Calorimetry (DSC)	p. 225
Dynamic Mechanical Analysis	p. 227
Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS)	p. 229
Electron Probe X-Ray Microanalysis (EPMA)	p. 230
Energy-Dispersive X-Ray Spectroscopy (EDS)	p. 231
Finite Element Analysis (FEA)	p. 232
Fourier Transform Infrared Spectroscopy (FTIR)	p. 235
Inductively Coupled Plasma Mass Spectrometry (ICPMS)	p. 236
Inductively Coupled Plasma-Optical Emission Spectroscopy (ICP-OES)	p. 237
In Situ Strain Gauges	p. 238
Ion Chromatography	p. 240
Mechanical Testing in IC Packaging	p. 243
Scanning Electron Microscopy (SEM)	p. 247
Scanning Tunneling Microscopy (STM) and Scanning Force Microscopy (SFM)	p. 248
Static Secondary Ion Mass Spectrometry (Static SIMS)	p. 249
Thermogravimetric Analysis (TGA)	p. 250
Thermomechanical Analysis (TMA)	p. 252
Torsional Braid Analysis (TBA)	p. 255
Wetting Balance Method to Evaluate the Solderability of IC Devices	p. 258
X-Ray Laminography	p. 260
X-Ray Photoelectron Spectroscopy (XPS)	p. 263
X-Ray Radiographic Inspection	p. 264
Index	p. 267
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